MSPP(Multi Service Provisioning Platform) Network Topology
SPECIFICATION
Layer | 12L~42L |
Thickness | 1.6T~4.8T |
Width & Space | Min.3/3mil |
Material | Middle-Tg, Halogen Free, Low CTE & Dk/Df, Megtron 6 or 7 |
PTH | Φ0.25 |
Special Requirement | Impedance Control, Back Drill |
SPECIFICATION
Layer | 22L |
Material | Megtron 6 or 7, 기타 |
Board Thickness | 2.6 mm |
Stub length | 6.0 ±4.0mil |
Back Drill Hole Size | Drill Hole Size + 8mil |
제품 및 구조