제품소개

MSPP(Multi Service Provisioning Platform) Network Topology

SPECIFICATION

Layer12L~42L
Thickness1.6T~4.8T
Width & SpaceMin.3/3mil
MaterialMiddle-Tg, Halogen Free, Low CTE & Dk/Df, Megtron 6 or 7
PTHΦ0.25
Special RequirementImpedance Control, Back Drill

STRUCTURE DESIGN

SPECIFICATION

Layer22L
MaterialMegtron 6 or 7, 기타
Board Thickness2.6 mm
Stub length6.0 ±4.0mil
Back Drill Hole SizeDrill Hole Size + 8mil

제품 및 구조