| MLB |
Max Layer |
~ 24L |
~ 42L |
~ |
| Board Thickness |
~ 2.4mm |
~ 4.8mm |
~ |
| Board Size |
510*620 |
|
|
| Min Trace Width/Space |
100/100 |
75/75 |
50/50 |
| Smallest Through Hole Size |
0.30Φ |
0.20Φ |
0.10Φ |
| BGA Pitch |
0.40mm |
0.35mm |
0.30mm |
| Solder Resist Clearance |
50㎛ |
30㎛ |
~ |
| Impedance (Single & Differential) |
10% |
7% |
~ |
| Aspect Ratio |
8 |
14 |
18 |
| Pad On Via & Build-Up Technology |
Yes |
|
|
| Conventional Blind & Buried Via Hole |
Yes |
|
|
| Hole Plugging Technology |
Yes |
|
|
| HDI |
Layer Structure |
IVH+2Stack Micro via |
IVH+3Stack Micro via |
All Layer Stack Micro via |
| Min Trace Width/Space |
100/100 |
75/75 |
50/50 |
| Micro Via Hole Size |
100/300 |
90/270 |
80/240 |
| Heavy Copper |
Max Layer |
~ 8L |
~ 12L |
~ 20L |
| Board Thickness |
~ 2.4mm |
~ 3.2mm |
~ 4.8mm |
| Copper Thickness |
4oz |
7oz |
10oz |
| Min Trace Width/Space |
250/250 |
200/200 |
~ |
| Smallest Through Hole Size |
0.30Φ |
0.25Φ |
~ |
| Aspect Ratio |
8 |
12 |
14 |
| Surface Treatment |
HASL / Pb-Free HASL |
Yes |
|
|
| OSP / ENIG / Electrolytic Au |
Yes |
|
|
| Immersion Ag / Immersion Tin |
Yes |
|
|
| OSP + ENIG |
~ |
Yes |
|
| Material |
FR-4 Tg 140℃, 150℃, 170℃ |
Yes |
|
|
| Halogen Free, Lead Free |
Yes |
|
|
| CTI 400, 600 |
Yes |
|
|
| Low Dk/Df |
~ |
Yes |
|
| Panasonic, Rogers, Nelco
(Teflon, Polyimide, Hydrocarbon) |
~ |
Yes |
|
| CNT(Carbon Nano Tube), PPE
|
~ |
Yes |
|
